Odisha Emerges as India’s Next Semiconductor Hub with Intel-Backed Projects
India has declared semiconductors a strategic priority, with the government committing billions in incentives to reduce dependence on imports and build a resilient technology ecosystem. While states like Gujarat and Tamil Nadu have attracted attention, Odisha is quietly emerging as a significant player in this national push. With multiple high-value projects on the horizon, the state is positioning itself as a hub for advanced electronics manufacturing. The upcoming visit of Intel CEO Lip-Bu Tan to Bhubaneswar for a groundbreaking ceremony underlines this transformation and marks a milestone for both Odisha and India’s semiconductor ambitions.
3D Glass Solutions: A Game-Changer for Odisha
The centrepiece of Intel’s involvement is the 3D Glass Solutions (3DGS) packaging plant, developed by Heterogeneous Integration Packaging Solutions Pvt Ltd. Backed by Intel, Lockheed Martin, and Applied Materials, the ₹1,943 crore project will have the capacity to produce nearly five crore semiconductor units annually. More importantly, it is projected to generate 1,500 direct jobs and up to 5,000 indirect jobs in sectors like logistics, testing, and component supplies. For Odisha, this represents not just foreign investment but a signal of global confidence in its ability to host world-class technology ventures.
SicSem and the Rise of Silicon Carbide
Parallel to the 3DGS project, Odisha is preparing for the groundbreaking of SicSem’s Silicon Carbide (SiC) fabrication facility, the first of its kind in India. Developed in collaboration with the UK-based Clas-SiC Wafer Fab, the project at Bhubaneswar’s InfoValley aims to make the state a pioneer in compound semiconductor technologies. Alongside SicSem, RIR Power Electronics is already developing its own SiC wafer plant worth ₹618 crore, with commercial production scheduled for March 2026. Together, these projects are expected to create more than 1,000 highly skilled jobs in engineering and research, along with another 3,000–4,000 indirect opportunities in supporting industries.
Policy Support: Building Talent and Capacity
Recognizing that infrastructure alone cannot sustain a semiconductor hub, the Odisha government has revised its semiconductor policy to make the state more competitive. It now offers incentives matching 50% of what the central government provides, creating a dual layer of support for investors. Beyond financial incentives, Odisha is investing in human capital: engineering students focusing on semiconductor design and manufacturing will receive stipends of ₹10,000, along with funding for developing commercial chip prototypes. Plans are also underway for dedicated training institutes and incubation centres, ensuring a steady pipeline of skilled professionals.
The Significance of Intel CEO’s Visit
Intel’s decision to send its top executive for the groundbreaking of 3DGS is not merely ceremonial. It signals strategic validation of Odisha’s industrial ambitions by one of the world’s most influential technology companies. Such endorsement is expected to attract further investments from global players, positioning Odisha not just as a participant but as a frontrunner in India’s semiconductor mission. For India, this also strengthens the credibility of its broader push for self-reliance in electronics manufacturing, a critical goal in an era of geopolitical uncertainty and disrupted supply chains.
Economic Impact and Strategic Gains
Combined, the 3DGS, SicSem, and RIR projects are projected to add over ₹10,000 crore to Odisha’s economy in the next decade. The multiplier effect—through ancillary industries, exports, and innovation—could be transformative. For India, Odisha’s rise adds a new geographic dimension to its semiconductor landscape, spreading opportunities beyond traditional industrial hubs. Moreover, with SiC-based fabrication and advanced packaging facilities, the state is not just filling gaps but positioning itself at the cutting edge of chip technologies.
Odisha at the Heart of India’s Chip Future
The anticipated visit of Intel’s CEO for the 3DGS groundbreaking is more than an endorsement—it is a moment of global recognition for Odisha’s semiconductor ambitions. Together with pioneering projects like SicSem’s SiC fab, the state is laying the foundation for a robust, innovation-driven economy. For India, these developments highlight how strategic policies and global partnerships can turn regional aspirations into national strengths. If successfully executed, Odisha could soon stand as a beacon of India’s semiconductor future—bridging local opportunity with global technology leadership.
(With agency inputs)
